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ChipArray Ball Grid Array (CABGA) Dummy Component


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CABGA
ChipArray® Ball Grid Array

ChipArray® Dummy (CABGA) packages are offered in laminate format and are available as Ball Grid Array. The near chip size standard outlines offer fixed body sizes and ball counts. With our dummy components the stablished SMT mounting processes and techniques are compatibly with ChipArray®. The dummy package size and design provides ideal RF operation (low inductance) for high speed applications requiring small footprints.

ChipArray® Ball Grid Array

Part Description

I/O Count

Pitch

Body Size

Ball Matrix

Ball
Alignment

Quantity
Per Tray

Available
Lead-Free Alloys

.5mm Pitch

 

A-CABGA40-.5mm-5mm

40

.5mm

5mm

8 x 8

Perimeter

624

SAC405, SAC105 or SAC305

A-CABGA56-.5mm-6mm

56

.5mm

6mm

10 x 10

Perimeter

408

SAC405, SAC105 or SAC305

.8mm Pitch

A-CABGA36-.8mm-6mm

36

.8mm

6mm

6 x 6

Full Array

608

SAC405, SAC105 or SAC305

A-CABGA49-.8mm-7mm

49

.8mm

7mm

7 x 7

Full Array

476

SAC405, SAC105 or SAC305

A-CABGA64-.8mm-8mm

64

.8mm

8mm

8 x 8

Full Array

360

SAC405, SAC105 or SAC305

A-CABGA144-.8mm-12mm

100

.8mm

12mm

13 x 13

Perimeter

189

SAC405, SAC105 or SAC305

A-CABGA100-.8mm-10mm

100

.8mm

10mm

10 x 10

Full Array

250

SAC405, SAC105 or SAC305

A-CABGA160-.8mm-12mm

160

.8mm

12mm

14 x 14

Perimeter

189

SAC405, SAC105 or SAC305

A-CABGA176-.8mm-13mm

176

.8mm

13mm

15 x 15

Perimeter

160

SAC405, SAC105 or SAC305

A-CABGA192-.8mm-14mm

192

.8mm

14mm

16 x 16

Perimeter

119

SAC405, SAC105 or SAC305

A-CABGA208-.8mm-15mm

208

.8mm

15mm

17 x 17

Perimeter

126

SAC405, SAC105 or SAC305

A-CABGA288-.8mm-19mm

288

.8mm

19mm

22 x 22

Perimeter

84

SAC405, SAC105 or SAC305

1.0mm Pitch

A-CABGA100-1.0mm-11mm

100

1.0mm

11mm

10 x 10

Full Array

207

SAC405, SAC105 or SAC305

A-CABGA144-1.0mm-13mm

144

1.0mm

13mm

12 x 12

Full Array

160

SAC405, SAC105 or SAC305

A-CABGA196-1.0mm-15mm

196

1.0mm

15mm

14 x 14

Full Array

126

SAC405, SAC105 or SAC305

A-CABGA256-1.0mm-17mm

256

1.0mm

17mm

16 x 16

Full Array

 90

SAC405, SAC105 or SAC305

Notes

* Parts are packaged in JEDEC trays when available.

* All components are available daisy-chained.

* <0.12mm (5 mil) coplanarity.

* Solder ball material is Eutectic 63/37 SnPb.

* BT (Bismaleimide-Triazine) substrates or equivalent.

* Package thickness is 1.5mm max for 0.8mm and 1.0mm pitch packages.

* Package thickness is 1.34mm max for 0.5mm pitch packages.

* Moisture sensitivity is JEDEC level 3.

* Lead-free parts are available with (SAC405) 95.5% Sn/ 4.0% Ag/ 0.5% Cu alloy or 96.5%Sn/3.0%Ag/0.5%Cu alloy (SAC305) or (SAC105) 98.5%Sn/1.0%Ag/0.5%Cu is also available.

* New: CABGA, CVBGA and CTBGA parts are available without
solder balls, which makes the package LGA. See page 27.

Part Description System

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* Add "TR" to end of part description for Tape and Reel

* Add "SAC405", "SAC105" or SAC305" to end of part description for Lead-Free.

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Package Pitch

A

B

C

D

1.00/0.80mm

0.46mm

0.48m

(± 0.05mm)

0.36mm

(± 0.05mm)

0.30mm

(± 0.05mm)

0.50mm

0.30mm

0.32mm

(± 0.05mm)

0.19mm

(± 0.05mm)

0.17mm

(± 0.03mm)

Note: Typical motherboard non-solder mask defined pad:

*0.50 pitch = 0.28

*0.80 pitch = 0.30

*1.00 pitch = 0.38




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