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Practical
is announcing that it will display its latest technology at the upcoming IPC High Reliability Forum and
exhibition scheduled to take place May 15-17, 2018 in Linthicum (Baltimore), MD.
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This catalog marks a major revision to the Practical Components catalog. Inside you will find over 20 pages
of new products and for the first time much of it is printed in color necessitated by multi-layer components
and complicated stack-up interconnects.
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Practical Components will partner with IPC Validation services in presenting their services at the annual Apex Conference & Exhibition: March 15-17 in booth 2205. Practical representatives will man the booth according to this schedule: Tuesday March 15:
Kevin Laphen 12:00-2:00pm
Russell Kido 3:30-5:30pm
Wednesday March 16:
Matt Olson 10:00-12:00pm
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Practical Components Inc., a worldwide supplier of dummy components, test boards and training kits, has appointed Neuro Technology Middle East Fze as its exclusive distributor of its products throughout the Middle East. [View PDF]
Practical Components has added the WALTS Co.
LTD. to it’s extensive line of Dummy Components and Test Boards. WALTS Co. LTD.headquartered in Fukuoka Japan develops and provides advanced test element group wafers (TEG) die/test kits. Their hi-technology wafers are used extensively worldwide in...
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Practical Components today announced that after many months of development the company has launched its new and completely redesigned web site.... [View PDF]
After the success of the Amkor® double and triple stack PoPs, Amkor has added a new TMV® PSvfBGA which supports single die, stacked die using wirebond or hybrid (Flip Chip + wirebond) stacks and has been applied for flip chip (FC) applications to improve warpage control and package integrity through test and SMT handling. [View PDF]
Practical Components Inc., the leading supplier of dummy components, announces the availability of a dummy version of the Amkor® middle
stacked package that makes a Triple Stack PoP package (PSvfBGA).
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Practical Components, a leading international distributor “dummy” components and SMD production tools and equipment, announces that it will showcase its latest technology at the 2008 Nepcon Shanghai
exhibition to take place April 8-11. Practical will be displaying their products with their exclusive Chinese distributor Kasion Automation Limited (KAL) in booth 1D05.
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Practical Components, a leading international distributor of “dummy” components and SMD production tools and equipment, announces that it will showcase its latest technology in representative AAT Aston GmbH’s booth in Stand 7-243 at the upcoming SMT/HYBRID/PACKAGING 2010 exhibition and conference, scheduled to take place 8-10 June, 2010 at the Messezentrum Nuremberg, Germany. [View PDF]
Practical Components and AAT AstonGmbH to introduce Triple Stack Package on Package and 15mm Dummy PoP Package at the upcoming SMT/HYBRID/PACKAGING 2008 exhibition and conference [View PDF]
Practical Components’ products are designed to help engineers qualify their technology, and train and grow their business while making significant cost savings. According to Practical President Kevin Laphen, “Practicals’ dummy products are selected with care to be the finest
“factory quality” components as well as boards and kits that simulate real world production.
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This test eight layer board is a 3x5 array with 15 components placements per board. The board is 132mm x 77mm in size, and 1.0mm thick. The standard surface finish is OSP. Our test vehicle
is designed for the new TMV® 620 solder ball .4mm pitch bottom component and the TMV® 200 solder ball .5mm top component.
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The new Practical Components catalog is designed to help
engineers quickly find the key products needed to qualify their technology, train and grow their businesses. This new catalog will be of special interest to anyone involved in PCB assembly, training, soldering and surface mount technology.
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El nuevo catálogo de Practical Components esta diseñado para ayudar a ingenieros a encontrar rápidamente los productos claves necesarios para calificar su tecnología, entrenar y crecer sus negocios. Este nuevo catálogo será del interés especial para alguien implicado en el ensamble de PCB, entrenamiento, soldado y tecnología de montaje superficial. [View PDF]
The Aegis Traceability and Control Validation Kit validates manufacturers’ plant traceability and control, and is available for purchase in the 2007 Practical Components Catalog, which is designed to help engineers quickly find the products needed to qualify their assembly technology. [View PDF]
Practical Components Inc., a leading international supplier of solder training kits and materials, mechanical IC samples or “dummy” components and SMD production tools and equipment, announces the availability of a dummy version of the Amkor® TMV® PoP package on package (PSvfBGA). [View PDF]
Practical Components Inc., a leading supplier of dummy components, will feature its new Amkor PoP stacked packages, including the new TMV PoP, along with its full line of dummy component packages in Booth #604 at the upcoming SMTA International Conference & Exhibition, scheduled to take place October 18-19, 2011 at the Fort Worth Convention Center in Fort Worth, TX. [View PDF]
Practical Components, leading international distributor of
mechanical IC samples or “dummy” components an announces that it will showcase its latest technology in representative AAT Aston GmbH’s booth in Hall B3, Stand 442 at the upcoming Productronica 2009 exhibition and conference, scheduled to take
place November 15-18, 2011 at the New Munich Trade Fair Center in Munich, Germany.
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Practical Components Inc. announces a new PACTECH PCB310 Flip Chip Test & Evaluation Board for placement and daisy chain continuity testing after assembly. This substrate has 28 mounting sites for 10 x 10 mm flip chips, and is the ideal companion to its PACTECH dummy flip chips. [View PDF]
Practical Components Inc. announces that its dummy components have been invited to be part of the “Future Proof Assembly Line” at the upcoming National Electronics Week exhibition, which is
scheduled to take place April 12-13, 2011 at NEC Birmingham, United Kingdom.
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Practical Components has added new Thermal Cycling and Drop test boards and kit for Amkor’s FusionQuad® components. The purpose of these boards is to standardize the test board and test methodology to provide a reproducible assessment of performance of FusionQuad® components while duplicating the failure modes normally observed during product level test. [View PDF]
Practical Components Inc., a worldwide supplier of dummy
components, test boards and training kits, has appointed Estanflux as its exclusive distributor of its products
throughout Spain and Portugal. The agreement was finalized during the recently held Productronica exhibition
in Munich in November 2011.
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Practical Components Inc., a leading supplier of dummy components, announces that the illustrated 2011-2012 Dummy Component Catalog is complete, free of charge and now available.
The updated version is the most comprehensive to date since Practical's first catalog in 1997
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Practical Components offers a display case containing a sampling of
components. The components included range from the latest in high technology (01005s, PoPs, CVBGAs, and Flip Chips) to standard SMT packages (PBGAs, MLFs, QFPs and TSOPs).
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Deanne Herman is Practical Components’ purchasing manager and is responsible for numerous duties including building and developing relationships with key customers, tracking purchasing activity and measurements, forecasting procurement needs, and implementing
procurement strategy and policies.
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Practical Components has introduced test board for it's dummy (mechanical sample) version of Amkor’s cutting-edge .3mm pitch CVBGA. Amkor’s new semiconductor device is a wafer-scale package in a miniature package, which is suitable for installation in surface mount technology (SMT). [View PDF]
Practical Components has added the Casio Micronics WLP Wafer Chip Size Package (W-CSP) to its comprehensive line of dummy components. The W-CSP is a miniature package, suitable for installation in surface mount technology (SMT). [View PDF]
Practical Components will introduce a new test board for its dummy (mechanical sample) version of Amkor’s cutting-edge 0.3 mm pitch CVBGA. Amkor’s new semiconductor device is a wafer-scale
package in a miniature package. Amkor’s ChipArray® range of packages consists of laminate-based ball grid array (BGA) packages.
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Practical Components, a leading international distributor of mechanical IC samples or “dummy” components and SMD production tools and
equipment, announces that it will showcase its latest technology at the 2008 APEX exhibition and conference to take place April 1-3 at the Mandalay Bay Resort and Convention Center, Las Vegas, Nevada.
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Practical Components announces that it will showcase its latest technology in representative AAT Aston GmbH’s booth in Halle A4 / Stand 480 at the upcoming Productronica 2007 exhibition and
conference to take place November 13-16, 2007 at the New Munich Trade Fair Center in Munich, Germany.
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Practical Components announces that it will showcase its latest technology at the 2008 INTERNEPCON JAPAN at the Tokyo Big Sight, Tokyo Japan with their Japanese Distributor, NISSHO MUSEN CO., LTD. [View PDF]
Practical Dummy Components is now supplying the Amkor FusionQuad™ representing a breakthrough in leadframe-based
plastic packaging through the effective integration of ExposedPad™ QFP and MLF® technologies.
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Following the success of their 2007 test board and kit, Practical Components and Aim Solder has updated their offering with a new AIM print test board and kit that is designed to include many printing challenges commonly in manufacturer’s assemblies. [View PDF]
Aegis Industrial Software Corporation (Aegis) and Practical Components Inc. (Practical) have partnered to offer a new and innovative traceability
and control kit.
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Head In Pillow (Hip) soldering defects are common with modern SMT component placement. Practical Components has created a component that is specifically designed to be susceptible to this defect. The PBGA 928-Hip .... [View PDF]
The CVBGA368-8mm Evaluation Board is perfect for testing, evaluating and qualifying this fine pitch technology. The board size is 77x132mm, 1mm thick, 4 layers with 15 pads for the CVBGA368 package. It is offered with OSP, ImAg, & ENIG finishes [View PDF]
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