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WALTS-TEG HPW MarkII-0101JY

Specifications

Wafer Size

8inch(Notch)

Wafer Thickness

725±25μm

Chip Size

10.0mm ■

Pad Size (Passivation Opening)	Pad ①～③	0.4mm ■ (0.3mm■)
	Pad ④	2.72mm x 0.5mm (2.32mmx 0.3mm)

Scribe Line Width

120μm

Function

Thermal Analysis by Diode
Heat Generation by Resistance
Insulation Resistance Test by High Voltage Plate

Electrode Material

Al pad

Number of Pad

12 pads

Number of Chip

224 chips/wafer

Maximum Output

Max.55W/Chip

Back Side Metallization