WLP TEG (0.4mm pitch & 0.3mm pitch)

WLP TEG	0.4mm pitch BGA	0.3mm pitch BGA
Wafer Size	8 inch	8 inch
Wafer Thickness	400±20μm	400±20μm
Chip Size	6.0mm ♦	6.0mm ♦
BGA pitch	400μm	300μm
Function	Daisy Chain	Daisy Chain
Electrode	Ball Mounted Solder Bump	Ball Mounted Solder Bump
Pad Size	(φ227μm)	(φ177μm)
Line width	25μm	20μm
Number of Pin	144 pins/chip	264 pins/chip
Number of Chip	712 chips/wafer	712 chips/wafer
		♦ Bottom Side