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Dummy SuperBGA®
SuperBGA® Dummy (SBGA) package is a very low profile, high-power BGA. The IC is directly attached to an integrated copper heatsink. Since the IC and the I/O are on the same side, signal vias are eliminated. The dummy die enables the Practical Dummy Component to have the same characteristics as the live component.
SBGA SuperBGA® 1.27mm Pitch |
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Part Description |
I/O Count |
Pitch |
Body Size |
Ball Matrix |
Ball |
Quantity |
A-SBGA256-1.27mm-27mm |
256 |
1.27mm |
27mm |
20 x 20 |
Perimeter |
40 |
A-SBGA304-1.27mm-31mm |
304 |
1.27mm |
31mm |
23 x 23 |
Perimeter |
27 |
A-SBGA352-1.27mm-35mm |
352 |
1.27mm |
35mm |
26 x 26 |
Perimeter |
24 |
A-SBGA432-1.27mm-40mm |
432 |
1.27mm |
40mm |
31 x 31 |
Perimeter |
21 |
A-SBGA520-1.27mm-40mm |
520 |
1.27mm |
40mm |
31 x 31 |
Perimeter |
21 |
A-SBGA560-1.27mm-42.5mm |
560 |
1.27mm |
42.5mm |
33 x 33 |
Perimeter |
12 |
A-SBGA600-1.27mm-45mm |
600 |
1.27mm |
45mm |
35 x 35 |
Perimeter |
12 |
Notes
* Superior thermal performance.
* Light weight
* Low profile (1.4mm mounted)
* Moisture resistant (JEDEC level 3)
* JEDEC MO-192 standard outlines
* Enhanced electrical performance > 1 GHz
* Parts are packaged in JEDEC trays.
* Call for tape and reel quantity and availability.
* Solder ball material is eutectic 63/37 SnPb.
* BGA packages should be baked at 125°C for 24 hours prior to assembly to prevent delamination during assembly process.
* Parts can be baked and dry-packed.
* All components are daisy-chained except for 520 I/O.
* Lead-free parts are available with (SAC405 )95.5% Sn/ 4.0% Ag/ 0.5% Cu alloy or 96.5%Sn/3.0%Ag/0.5%Cu alloy (SAC305). Sn3.5Ag is also available (call for availablity).
* SBGAs are not available without solder balls.
Part Description System
* Add "TR" to end of part number for Tape and Reel.
* Add "SAC405" or "SAC305" or "Sn3.5Ag" to end of part number for Lead-Free.
Note: Drawing not to scale.
Package |
Pitch |
A |
B |
C |
SBGA |
1.27 |
.76 |
.62 |
.52 |
All units in mm.
Assumptions: 5 mils solder paste. Solder mask defined pad. Typical motherboard no solder mask defined pad:
* 0.50 Pitch 0.28
* 0.80 Pitch 0.30
* 1.00 Pitch 0.38