SMTA-UltraHDI Miniaturized Test Board

Introducing the Ultra HDI Miniaturized Test Vehicle designed to test and develop DFMA guidelines guidelines for the next level of electronics miniaturization. 

The migration of circuitry to Ultra HDI brings many bene"ts in terms of miniaturization.# !e fabrication technology is undergoing a step-function change in densities – and therefore functionalities – that will enable an entire new generation of electronics for defense, healthcare, transportation and communications.

The fact that a printed circuit board can be fabricated does not necessarily indicate that it can also be assembled. For high-performance products, very little reliability data exists for high reliability UHDI assemblies.

The newly released SMTA Ultra HDI Assembly Test Board brings special attention in terms of validating new processes needed with this miniaturization and testing the reliability of their outputs.

The fact that a printed circuit board can be fabricated does not necessarily indicate that it can also be assembled. For high-performance products, very little reliability data exists for high reliability UHDI assemblies.

The newly released SMTA Ultra HDI Assembly Test Board brings special attention in terms of validating new processes needed with this miniaturization and testing the reliability of their outputs.

Notes

• Board finishes available are: Immersion Silver, ENIG, and OSP.

• Gerber Data and X, Y Theta Data are available at no charge.