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Specifications | STD | ||||
Wafer Size | 8 inch (Notch) | ||||
Wafer Thickness | 725±25μm | ||||
Chip Size | 12.0mm ♦ | ||||
Function | Daisy Chain & Migration | ||||
Pad Pitch |
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Electrode | Cu Pillar | ||||
Pad Size | 54μm ♦ | ||||
Bump Size | φ31μm | ||||
Passivation opening | 48μm ♦ | ||||
Scribe width | 120μm | ||||
Number of Bump/Pad |
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Number of Chip | 177 chips/wafer | ||||
♦ Bottom Side |