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Small Shrink Outline Package (SSOP)



Small Shrink Outline Package (SSOP)

Small Shrink Outline Package (SSOP)

Small Shrink Outline Package (SSOP)

Small Shrink Outline Package (SSOP)

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SSOP
Small Shrink Outline Package

The Small Shrink Outline Package (SSOP) body size is compressed and the lead pitch is tightened to obtain a small version of the standard SOIC packages. Lead counts range from 8 to 64. Body sizes are 209 and 300 mils. The SSOP package is JEDEC and EIAJ compliant. The package leads are solder plated.

SSOP Small Shrink Outline Package

Part Description

Number
of Pins

Body Width

Pitch

Quantity
Per Tube

Tape Width

Tape Pitch

Quantity
13" Reel

A-SSOP14T-5.3mm

14

5.3mm

.65mm

100

16mm

12mm

1,000

A-SSOP16T-5.3mm

16

5.3mm

.65mm

80

16mm

12mm

1,000

A-SSOP20T-5.3mm

20

5.3mm

.65mm

62

16mm

12mm

1,000

A-SSOP24T-5.3mm

24

5.3mm

.65mm

66

16mm

12mm

1,000

A-SSOP28T-5.3mm

28

5.3mm

.65mm

47

16/24mm

12mm

1,000

A-SSOP36T-7.6mm

36

7.6mm

.8mm

31

24mm

12mm

1,000

A-SSOP48T-7.6mm

48

7.6mm

.635mm

30

32mm

12/16mm

1,000

A-SSOP56T-7.6mm

56

7.6mm

.635mm

26

32mm

12/16mm

500

Notes

* Tube quantity may vary.

* Parts available on Tape and Reel upon special request.

* 209 and 300 mil body widths.

* JEDEC and EIAJ package outline standard compliance.

* High-conductivity copper leadframes.

* Eutectic solder plating is 85/15 Sn/Pb.

* Moisture sensitivity is JEDEC level 3.

* Lead-free available with 100% Matte Sn alloy.

Part Description System


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* Add "T" for Tubes or "TR" for Tape and Reel to end of part number.

* Add "ePad" to beginning of part number when ordering ExposedPad package.

* Add "Sn" to end of part number for Lead-Free.

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Note: Drawings not to scale.