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Thin Shrink Small Outline Package (TSSOP)


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TSSOP
Thin Shrink Small Outline Package

The Thin Shrink Small Outline Package (TSSOP) offers smaller body sizes, smaller lead pitches and package thickness (0.9mm thick) than standard SOIC packages. Body widths are 3.0mm, 4.4mm and 6.1mm. Lead counts range from 8 to 80. This package conforms to JEDEC package outlines.

TSSOP Thin Shrink Small Outline Package

Part Description

Number
of Pins

Body
Width

Pitch

Tape
Width

Tape
Pitch

Quantity
Per Tube

Quantity
Per Reel

A-TSSOP8T-3.0mm

8

3.0mm

.65mm

12mm

8mm

98

2,500

A-TSSOP8T-4.4mm

8

4.4mm

.65mm

12/16mm

8mm

100

1,000/2,500

A-TSSOP10T-3.0mm

10

3.0mm

.5mm

12mm

8mm

98

2,500

A-TSSOP14T-4.4mm

14

4.4mm

.65mm

12/16mm

8mm

96

1,000/2,500

A-TSSOP16T-4.4mm

16

4.4mm

.65mm

12/16mm

8mm

96

1,000/2,500

A-TSSOP20T-4.4mm

20

4.4mm

.65mm

16mm

8/12mm

74

1,000/2,500

A-TSSOP24T-4.4mm

24

4.4mm

.65mm

16mm

8/12mm

62

1,000/2,500

A-TSSOP28T-4.4mm

28

4.4mm

.65mm

16mm

8/12mm

50

1,000

A-TSSOP28T-6.1mm

28

6.1mm

.65mm

24mm

12mm

50

1,000

A-TSSOP44T-4.4mm

44

4.4mm

.5mm

24mm

12mm

42

1,000

A-TSSOP48T-6.1mm

48

6.1mm

.5mm

24mm

12mm

39

1,000

A-TSSOP56T-4.4mm

56

4.4mm

.4mm

24mm

12mm

42

1,000

A-TSSOP56T-6.1mm

56

6.1mm

.5mm

24mm

12mm

35

1,000

A-TSSOP64T-6.1mm

64

6.1mm

.5mm

N/A

N/A

28

N/A

A-TSSOP80T-6.1mm

80

6.1mm

.4mm

N/A

N/A

28

N/A

Notes

* 0.9mm body thickness for 4.4 and 6.1mm body widths.

* 0.85mm body thickness for 3.0mm body width.

* JEDEC package outline is standard.

* High conductivity copper leadframes.

* Very low-stress mold compound.

* Tube quantity may vary.

* Parts available on Tape and Reel upon request..

* Lead-free available with 100% Matte Sn alloy.

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Part Description System


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* Add "T" for Tubes or "TR" for Tape and Reel to end of part number.

* Add "Sn" to end of part number for Lead-Free.

TSSOP Package

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