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Plastic Ball Grid Array (PBGA) Dummy Component


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Dummy PBGA
Plastic Ball Grid Array

Dummy Plastic Ball Grid Arrays (PBGA) incorporate advanced assembly processes and designs for low cost, high performance applications. PBGA dummies are designed for low inductance, improved thermal operation and enhanced SMT-ability.

All dummy PBGAs listed on this page are daisy-chained and available lead-free.

Some PBGAs are available daisy-chained. All PBGAs are available lead-free.

PBGA Plastic Ball Grid Array 1.0mm Pitch

Part Description

I/O Count

Pitch

Body Size

Ball Matrix

Ball
Alignment

Quantity
Per Tray

Available
Lead-Free Alloys

A-PBGA208-1.0mm-17mm

208

1.0mm

17mm

16 x 16

Perimeter

90

SAC405, SAC305 or Sn3.5Ag

A-PBGA256-1.0mm-17mm

256

1.0mm

17mm

16 x 16

Full Array

90

SAC405, SAC305 or Sn3.5Ag

A-PBGA288-1.0mm-23mm

288

1.0mm

23mm

22 x 22

Perimeter

60

SAC405, SAC305 or Sn3.5Ag

A-PBGA289-1.0mm-19mm

289

1.0mm

19mm

17 x 17

Full Array

84

SAC405, SAC305 or Sn3.5Ag

A-PBGA324-1.0mm-19mm

324

1.0mm

19mm

18 x 18

Full Array

84

SAC405, SAC305 or Sn3.5Ag

A-PBGA324-1.0mm-23mm

324

1.0mm

23mm

22 x 22

Perimeter

60

SAC405, SAC305 or Sn3.5Ag

A-PBGA484-1.0mm-27mm

484

1.0mm

27mm

26 x 26

Perimeter

40

SAC405, SAC305 or Sn3.5Ag

A-PBGA516-1.0mm-31mm

516

1.0mm

31mm

30 x 30

Perimeter

27

SAC405, SAC305 or Sn3.5Ag

A-PBGA580-1.0mm-35mm

580

1.0mm

35mm

34 x 34

Perimeter

24

SAC405, SAC305 or Sn3.5Ag

A-PBGA676-1.0mm-27mm

676

1.0mm

27mm

26 x 26

Full Array

40

SAC405, SAC305 or Sn3.5Ag

A-PBGA680-1.0mm-35mm

680

1.0mm

35mm

34 x 34

Perimeter

24

SAC405, SAC305 or Sn3.5Ag

A-PBGA928-1.0mm-40mm

928

1.0mm

40mm

39 x 39

Perimeter

21

SAC405, SAC305 or Sn3.5Ag

A-PBGA1156-1.0mm-35mm

1,156

1.0mm

35mm

34 x 34

Full Array

24

SAC405, SAC305 or Sn3.5Ag

 

Notes

* Overall thickness of 1.0mm pitch PBGA packages will vary (please call for more details).

* Parts are packaged in JEDEC trays.

* Call for tape and reel quantity and availability.

* Solder ball material is eutectic 63/37 SnPb.

* All components are daisy-chained.

* Daisy-chained connections are connections between I/O (input/output) of the component.

* BT (Bismaleimide-Triazine) substrates.

* JEDEC MS-034 standard outlines.

* Ball diameter varies (see chart).

* BGA packages should be baked at 125ºC for 24 hours prior to assembly to prevent delamination during the assembly process.

* Moisture sensitivity is JEDEC level 3.

* Lead-free parts are available with (SAC405) 95.5% Sn/ 4.0% Ag/ 0.5% Cu alloy or 96.5%Sn/3.0%Ag/0.5%Cu alloy (SAC305) is also available. Sn3.5Ag is also available (call for availability).

* PBGAs are not available without solder balls.

Practical does not guarantee the chain of custody for moisture sensitivity. This is due to the factory making consolidated shipments and customers quantity being met (breaking full tray quantities).

Part Description System

PBGA Plastic Ball Grid Array 1.27mm Pitch

Part Description

I/O Count

Pitch

Body Size

Ball Matrix

Ball
Alignment

Quantity
Per Tray

Available
Lead-Free Alloys

A-PBGA208-1.27mm-23mm*

208

1.27mm

23mm

17 x 17

Perimeter

60

SAC405, or SAC305 or Sn3.5Ag

A-PBGA217-1.27mm-23mm*

217

1.27mm

23mm

17 x 17

Perimeter

60

SAC405, or SAC305 or Sn3.5Ag

A-PBGA256-1.27mm-27mm*

256

1.27mm

27mm

20 x 20

Perimeter

40

SAC405, or SAC305 or Sn3.5Ag

A-PBGA272-1.27mm-27mm*

272

1.27mm

27mm

20 x 20

Perimeter

40

SAC405, or SAC305 or Sn3.5Ag

A-PBGA329-1.27mm-31mm

329

1.27mm

31mm

23 x 23

Perimeter

27

SAC405, or SAC305 or Sn3.5Ag

A-PBGA356-1.27mm-27mm*

356

1.27mm

27mm

20 x 20

Perimeter

40

SAC405, or SAC305 or Sn3.5Ag

A-PBGA388-1.27mm-35mm*

388

1.27mm

35mm

26 x 26

Perimeter

24

SAC405, or SAC305 or Sn3.5Ag

A-PBGA420-1.27mm-35mm

420

1.27mm

35mm

26 x 26

Perimeter

24

SAC405, or SAC305 or Sn3.5Ag

A-PBGA456-1.27mm-35mm

456

1.27mm

35mm

26 x 26

Perimeter

24

SAC405, or SAC305 or Sn3.5Ag

A-PBGA564-1.27mm-40mm*

564

1.27mm

40mm

30 x 30

Perimeter

21

SAC405, or SAC305 or Sn3.5Ag

Notes

* * = DC available

* Parts are packaged in JEDEC trays.

* Call for tape and reel quantity and availability.

* Solder ball material is eutectic 63/37 SnPb.

* Daisy-chained connections are connections between I/O (input/output) of the component.

* BT (Bismaleimide-Triazine) substrates.

* JEDEC MS-034 standard outlines.

* Ball diameter varies (see chart).

* BGA packages should be baked at 125ºC for 24 hours prior to assembly to prevent delamination during the assembly process.

* Moisture sensitivity is JEDEC level 3.

* Lead-free parts are available with (SAC405) 95.5% Sn/ 4.0% Ag/ 0.5% Cu alloy or 96.5%Sn/3.0%Ag/0.5%Cu alloy (SAC305) or Sn3.5Ag (call for SnAg availability)

* PBGAs are not available without solder balls.

Part Description System

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* Add "TR" to end of part number for Tape and Reel.

* Add SAC405 or SAC305 or Sn3.5Ag to end of part number for Lead-Free.

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7589.png

Drawing not to scale.

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Package

Pitch

Solder Ball
Diameter
(A)

Solder Ball Land On Package and Board

Solder Ball Height on Package
(B)

Solder Joint Height After SMT*
(C)

(1)PBGA

1.00

0.50

0.45

0.40

0.32

(2)PBGA

1.00

0.63

0.45

0.55

0.48

PBGA

1.27

0.76

0.63

0.60

0.52

PBGA

1.50

0.76

0.63

0.60

0.52

 

Notes

* (1) applies to 13, 15 and 17mm packages.
* (2) applies to 23, 27, 31, 35mm, 37.5mm and 40.0mm packages.

* Units = mm

Assumptions:
* 5 mils Solder Paste
* Solder Mask Defined Pad




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