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CSPnl .4mm Pitch Dummy Wafer (RDL)-Amkor


CSPnl .4mm Pitch Dummy Wafer (RDL)-Amkor

Practical Components introduces our new CSPnl (RDL) dummy wafers from Amkor Technology. The CSPnl Bump on Redistribution (RDL) option adds a plated copper redistribution layer to route I/O pads to JEDEC / EIAJ standard pitches, avoiding the need to redesign legacy parts for CSP applications. Nickel-based or copper UBM is offered, along with polyimide or PBO repassivation. CSPnl with RDL utilizes industry-standard surface mount assembly and reflow techniques, and does not require underfill.

This 8 inch wafer can be provided diced into individual die or as an uncut wafer. The wafer can be provided with SAC405 bumps, SAC305 bumps or no bumps. Pad pitch is 400um (0.4mm). Wafer thickness is 725um, with back grinding available to 200um.Pads on this wafer are daisy chained and can be cut to most any size requested. Packaging is tape and reel bumps down for cut die or cut and in the ring. Uncut 8inch wafers are shipped in plastic wafer packs.

There is much of flexibility with this type of component. Please call our technical representatives at 714-252-0010 for additional information. In addition to the wafer Practical Components can also provide a test board (substrate) on request.

A-CSPnl-Wafer-.4-DC-SAC405 (P/N 32101) 8” wafers with SAC405 ball daisy-chained 0.4mm pitch / 725um thickness

Offered as uncut whole wafers or diced die. Backgrinding to 200um.

Die can be packaged on Tape & Reel (pads down) or on tape/ring (no DAF).

Pad I/O

Pad Matrix

Pitch

Die Sizes

Tape & Reel

4

2x2

0.4mm

0.76mm

W=8mm P=4mm

16

4x4

0.4mm

1.56mm

W=8mm P=4mm

36

6x6

0.4mm

2.36mm

W=12mm P=8mm

64

8x8

0.4mm

3.16mm

W=12mm P=8mm

100

10x10

0.4mm

3.96mm

W=12mm P=8mm

144

12x12

0.4mm

4.76mm

W=12mm P=8mm

196

14x14

0.4mm

5.56mm

W=12mm P=8mm

400

20x20

0.4mm

8.00mm

W=12mm P=8mm

 

 

 




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