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WLP TEG (0.4mm pitch & 0.3mm pitch)




 

WLP TEG

0.4mm pitch BGA

0.3mm pitch BGA

Wafer Size

8 inch

8 inch

Wafer Thickness

400±20μm

400±20μm

Chip Size

6.0mm ♦

6.0mm ♦

BGA pitch

400μm

300μm

Function

Daisy Chain

Daisy Chain

Electrode

Ball Mounted Solder Bump

Ball Mounted Solder Bump

Pad Size

(φ227μm)

(φ177μm)

Line width

25μm

20μm

Number of Pin

144 pins/chip

264 pins/chip

Number of Chip

712 chips/wafer

712 chips/wafer

   

♦ Bottom Side






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