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WLP TEG (0.4mm pitch & 0.3mm pitch)




 

WLP TEG

0.4mm pitch BGA

0.3mm pitch BGA

Wafer Size

8 inch

8 inch

Wafer Thickness

400±20μm

400±20μm

Chip Size

6.0mm ♦

6.0mm ♦

BGA pitch

400μm

300μm

Function

Daisy Chain

Daisy Chain

Electrode

Ball Mounted Solder Bump

Ball Mounted Solder Bump

Pad Size

(φ227μm)

(φ177μm)

Line width

25μm

20μm

Number of Pin

144 pins/chip

264 pins/chip

Number of Chip

712 chips/wafer

712 chips/wafer

   

♦ Bottom Side






IPC Validation Services

New Product

.4mm Pitch eWLP Dummy Wafer-Amkor
.4mm Pitch eWLP Dummy Wafer-Amkor

Walts

Technical Center

In the News

Practical Components’ Publishes New 2017 Product Catalog
This catalog marks a major revision to the Practical Components catalog. Inside you will find over 20 pages of new products and for the first time much of it is printed ... [read more]

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