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SIPOS-TEG SI06




Practical Components SIPOD-TEG SI06

 

Specifications TYPE-A TYPE-B
Wafer Size 8 inch 8 inch
Wafer Thickness 725±25μm 725±25μm
Chip Size 10.0mm 10.0mm
Pad Surface Cu Cu
Pad Pitch 200μm -
Pad Size 160um 160um
Evaluation Pattern

>Comb-Pattern
>Transmission Characteristics Measuring Pattern 1
>Transmission Characteristics Measuring Pattern 2
>L/S Check Pattern
>Dot Pattern

>Comb-Pattern
>Single-Line
Number of Pad

96pads

36pads





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