Specifications FBW200-0001JY FBW150-0001JY FBW130-0001JY FBW100-0001JY FBW80-0001JY
Wafer Size 8 inch 8 inch 8 inch 8 inch 8 inch
Wafer Thickness 725±25μm 725±25μm 725±25μm 725±25μm 725±25μm
Bump Pitch 200μm 150μm 130μm 100μm 80μm
Function x x x x x
Electrode Cu Pillar Cu Pillar Cu Pillar Cu Pillar Cu Pillar
Bump Size φ90μm φ75μm φ65μm φ50μm φ40μm
Bump Height Max.60μm Max.60μm Max.60μm Max.60μm Max.50μm

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.4mm Pitch eWLP Dummy Wafer-Amkor
.4mm Pitch eWLP Dummy Wafer-Amkor


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Practical Components’ Publishes New 2017 Product Catalog
This catalog marks a major revision to the Practical Components catalog. Inside you will find over 20 pages of new products and for the first time much of it is printed ... [read more]

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