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Specifications FBW200-0001JY FBW150-0001JY FBW130-0001JY FBW100-0001JY FBW80-0001JY
Wafer Size 8 inch 8 inch 8 inch 8 inch 8 inch
Wafer Thickness 725±25μm 725±25μm 725±25μm 725±25μm 725±25μm
Bump Pitch 200μm 150μm 130μm 100μm 80μm
Function x x x x x
Electrode Cu Pillar Cu Pillar Cu Pillar Cu Pillar Cu Pillar
Bump Size φ90μm φ75μm φ65μm φ50μm φ40μm
Bump Height Max.60μm Max.60μm Max.60μm Max.60μm Max.50μm





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.4mm Pitch eWLP Dummy Wafer-Amkor
.4mm Pitch eWLP Dummy Wafer-Amkor

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Practical Components to Exhibit at the IPC High Reliability Forum
Practical is announcing that it will display its latest technology at the upcoming IPC High Reliability Forum and exhibition scheduled to take place May 15-17, 2018 in ... [read more]

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