Practical Components is an authorized distributor of IPC materials. IPC is a nonprofit organization dedicated to the printed circuit board fabrication and electronics assembly industry, with a focus on technology enhancement programs, the creation of relevant standards, protection of the environment, and pertinent government relations. All IPC materials are developed and approved by trainers and other experts to insure technical accuracy and consensus of standards within the industry.
All Practical Components training kits meet the relevant IPC standards and make ideal companions to your training program. Practical’s knowledgeable sales professionals have all the information you need to take your processes and training into the 21st century.
Listed below is a representative sample of our most requested IPC training titles. If you don’t see the title you need or you need an update of newly released available products, please contact us.
Designed by human resource managers, this video provides an introductory overview of basic assembly processes. Also describes how the assembly operation fits into the electronics industry and explains the history of through-hole and surface mount technologies. Covers the importance of communication with supervisors, continuous improvement, work attitude, teamwork, original equipment manufacturers / electronic manufacturing services industry relationships, and introduces personal safety, handling considerations and electrostatic discharge. Includes Leader’s Guide and Student’s Workbook.
Explains the importance, benefits and proper technique for handling printed circuit boards, components, and electronic assemblies. Explores the typical causes of contamination and shows how fingerprints and oxidation can affect the formation of a good solder joint. Discusses flux residues, solvent extract tests, and dendritic growth. Also covers in-process storage and transport, along with basic principles of ESD prevention.
Designed to provide an increased awareness about the “invisible” problems that can be caused by careless handling. Includes Leader’s Guide and Student Workbook.
Begins with an overview of the assembly process to help provide context for understanding hardware buildup procedures. Provides a visual overview of the tools used in the mechanical assembly of electronics products, proper installation for hardware and fasteners, interconnection of electronic assemblies and mechanical construction of the cabinet. Also includes handling practices, personal safety and ergonomics.
A great way to introduce new employees to the complexities of hardware buildup. Includes Leader’s Guide and Student Workbook. (Winner of the Communicator and Vision Awards.)
Begins with a discussion of the importance of electrical testing; then provides a visual overview of a typical automatic tester. Explains the differences between in-circuit test, automatic functional test, functional bench test and final test. Details typical procedures for performing all aspects of in-circuit test and functional test. Concludes with a discussion of reliability testing. Includes Leader’s Guide and Student Workbook.
Visually demonstrates workstation practices, personal safety considerations, ESD prevention, soldering iron types, temperature selection, tip types and applications, heat transfer principles, how to avoid thermal damage, solder types / sizes and application, flux theory, low residue fluxes, and wetting principles.
VT-43 covers hand soldering procedures for soldering through-hole components onto printed circuit boards, tip tinning, tip / tool maintenance, reheating solder, heat sinks / thermal shunts, soldering thick boards, preheating, cleaning flux residues, and solder joint workmanship requirements to IPC-A-610C—including: fillet shapes / contact angles, cold and disturbed solder, fractures, thermal damage, lifted lands, excessive solder, solder bridging, solder projections, solder balls, nonwetting, dewetting, blowholes, pinholes and product classes per J-STD-001.
Part 1: Tools and Materials
An introductory explanation of the terminology and tools for hand soldering. Covers workbench cleanliness and contamination, personal safety, ESD, soldering irons and tips, heat transfer, thermal damage, solder types and sizes, fluxes, oxidation, wetting, intermetallic, and flux residues.
Part 2: Soldering Techniques
Explains the hand soldering process for through-hole components, from tip maintenance to flux removal. Also describes the characteristics of the ideal solder joint and the results of improper techniques, including: cold / disturbed joints, fractures, thermal damage, lifted lands, barrel cracks, blowholes, excess solder, bridging, non-wetting and dewetting. Includes Leader’s Guide and Student Workbook. Spanish language version.
Explains what a low residue flux is and how it compares to other fluxes. Describes changes to the existing hand soldering process and covers hand soldering theory with low residue fluxes. Discusses visual inspection criteria for solder joints and flux residues, wetting considerations, and the importance of the solder heat bridge. Other topics covered are ideal solder feed rates and techniques, lower temperature soldering and the increased importance of tip maintenance. Soldering demonstrations include through-hole components, gull wings, J-Leads and turret terminals.
This video can be used to train new hires or as a refresher for technicians who have been hand soldering for years. Also helps clarify the important reasons to modify existing hand soldering techniques. Includes a Leader’s Guide and Student Workbook.
A visual explanation of tinning the soldering iron tip, stripping the insulated wire, tinning the wire and cleaning the iron tip. Demonstrates the proper method of attaching and soldering wires to turret terminals, cup terminals, bifurcated terminals, hook terminals, and pierced terminals. Discusses the importance of soldering for inspectability. Provides the criteria for recognizing the preferred solder joint, along with the minimum and maximum standards for acceptability. Includes Leader’s Guide and Student Workbook.
Designed to help prevent costly errors and unnecessary rework… The Seven Sins of Hand Soldering is the cure for improper soldering techniques that even the most experienced solder technicians often succumb to: excessive pressure, improper solder heat bridge, wrong tip size, excessive temperature, improper use of flux, transfer soldering and unnecessary rework or repair. VT-49 explores each of these sins—explaining how bad habits can create undesirable results—while clearly presenting the proper technique so the habit can be eliminated. This visual training tool can also be used proactively—for new hires—to prevent bad habits before they start.
If you’re serious about quality, this video presentation will be the perfect addition to any company’s continuous education / improvement program. A must for effective and preventive ongoing training—to help resolve your most challenging hand soldering problems. Winner of US International Film and Video Festival Award for Creative Excellence. Includes a Leader’s Guide, Student Workbook and Test.
Now you can train and certify your operators in through-hole and surface mount component identification. Association sponsored certification is an excellent way to recognize your employees and demonstrate that your company is serious about standardized, technically accurate workforce development.
This two-part video begins by explaining the function of active and passive electronic components, reviews the basic through-hole and surface mount assembly processes, and covers component part numbers, bill of materials, component reference designators, markings, orientation, and polarity. VT-64C describes and illustrates all of the common through-hole and surface mount component types. Also introduces resistor values and tolerances.
The certification test includes 40 questions on through-hole and surface mount components and can be used by as many students as required within your facility. An IPC Training Certificate is included for issue to students scoring 70% and above on the certification test. The VT-64C training package also includes a Leader’s Guide with course outline, learning objectives, and chapter review questions to prepare students for the training certification test. Also includes one copy of DRM-18F Desk Reference Manual for Component ID.
IPC-A-610 Class A Certified Instructors can now teach the latest surface mount and through-hole requirements from the new IPC-A-610 Rev. C—with help from two new IPC training videos.
This set reviews the IPC-A-610C scope and purpose and highlights key solder fillet dimensional criteria from sections 6 (Soldering) and Section 12 (Surface Mount Assemblies) of the Worker Proficiency Training Course. Video simplifies instruction and solves many practical problems, such as when an operator is forced to miss a portion of the training. The tapes are also an excellent way for students to reinforce what they learned in class prior to taking the open and closed book examinations. Includes additional photos, video and animation to illustrate important concepts. Brings a new alternative medium to classroom lecture and slides, which improves students’ interest and retention. (Intended to supplement the IPC-A-610 Class A Instructor training course.) Presented by Tom Parkinson of WinTronics Inc., Sharon PA an experienced IPC-A-610 Class A Instructor.
Dozens of microphotographs combine with detailed computer animation to provide assembly inspectors with the essential knowledge required to make pass / fail decisions on through-hole assemblies. This video looks at how a solder joint is made and explains key terminology, including wetting, fillet, contact angle and the parts of a solder joint. Section 2 details minimum acceptable conditions as presented in the IPC-A-610B and the J-STD-001B. Using computer animation, each of the five criteria listed in those standards are carefully and completely explained. The last section of the video covers solder defects and conditions and explains the acceptance criteria for each class of assemblies.
Emphasis is placed on understanding the difference between cosmetically imperfect but acceptable solder joints and those which fall below minimum acceptable levels, as well as the pitfalls of unnecessary rework. Includes a Leader’s Guide and matching Learner’s Workbook. Also includes a copy of the 32-page Through-Hole Solder Joint Evaluation Desk Reference Manual. (Also see VT-40-SS in Image Resources for 35 mm slides from this video.) (Winner of the Aegis and Aurora Gold Awards.)
All five videos in this training series on surface mount solder joint evaluation (VT-71 through VT-75) have been updated to reflect the current requirements of the IPC-A-610B and the J-STD-001B. Additional changes were also made to reflect current technologies. Each video in the updated series is priced individually at $350. Every tape also includes a free copy of the new Desk Reference Manual on Surface Mount Solder Joint Evaluation. Purchase all five videos in the series (VT-71, 72, 73, 74, 75) and save 50% off the individual purchase price.
Part 1: Introduction
Explains the history of component evolution from through-hole to surface mount, the advantages of SMT, defines 3 classes of products based on the ANSI/J-STD-001B specification, discusses the causes of solder joint imperfections, and defines related terminology. Also identifies the different types of discrete chip components and metallizations, and provides an introductory example of how to analyze the acceptance criteria and dimensional requirements for minimum/maximum solder conditions. Automatic placement, solder paste adhesive application, wave soldering, and reflow soldering are also demonstrated. (Also see IPC-VT-71-SS Slide Set in Image Resources) Includes a Leader’s Guide, Student Workbook, and DRM-SMT.
Part 2: Chip Components
Analyzes rectangular chip component solder joint typical failure mechanisms and decisions for rework. Provides the dimensional criteria from the ANSI/J-STD-001B Specification for all three classes of products, including Maximum Side Overhang, Minimum End Joint Width, Minimum End Overlap, Minimum Solder Joint Height, and Maximum Solder Thickness. Also reviews typical soldering defects and causes, insufficient and excessive solder, contact angles, drawbridging and tombstoning, webbing, disturbed or cold solder joints, solder bridging, solder balls, and mounting adhesive inside solder joints. Voids, pinholes, pits, blowholes, nonwetting and dewetting for 1, 2, 3, and 5-face rectangular chip components are also covered. Includes Leader’s Guide, Student Workbook, and DRM-SMT. (Also see IPC-VT-72-SS Slide Set in Image Resources.)
Part 3: Bottom-Only & MELFs
Covers bottom-only and MELF surface mount chip components, including component identification, wetting, contact angles, nonwetting, shadowing, dewetting, smoothness, grain texture, contamination, voids, blowholes, solder volume, and all types of dimensional requirements for minimum solder joint sizes / overhangs. The acceptance criteria comes from the ANSI/J-STD-001B covering consumer, commercial and hi-rel requirements. Includes Leader’s Guide, Student Workbook, and DRM-SMT. (Also see IPC-VT-73-SS Slide Set in Image Resources.)
Part 4: Gull Wing Components
Defines the acceptance criteria for gull wing component—surface mount solder joints (QFPs, SOICs, SOTs) as described in ANSI/J-STD-001B for minimum/maximum solder joint sizes. Includes discussion on lead coplanarity, typical problems, solder bridging, preferred fillet configuration, thermal expansion considerations, visibility and inspectability, and misalignment criteria for all types of component overhangs. Includes Leader’s Guide, Student Workbook, and DRM-SMT. (Also see IPC-VT-74-SS Slide Set in Image Resources.)
Part 5: J-Lead Components
IPC-VT-75 defines the acceptance criteria for J-Lead surface mount solder joints as recommended in ANSI/J-STD-001B for minimum/maximum solder joint sizes. Includes discussion of typical problems, lead coplanarity, preferred fillet configurations, thermal expansion considerations, when/when not to rework, visibility and inspectability, and misalignment criteria for all types of component overhangs for all three classes of assemblies. Includes a Leader’s Guide, Student Workbook and DRM-SMT. (Also see IPC-VT-75-SS Slide Set in Image Resources.)
Walks your trainers, operators, inspectors and project managers through each of the important changes in the new IPC-A- 610 Revision C. Discusses the important details within each section of the standard—so you can review only the information you need. Explains how the conflicts between J-STD-001 (The National Soldering Standard) and IPC-A-610C have been resolved. Ensures that everyone in your company receives consistent information. Provides an ideal platform to initiate group discussion—allowing you to decide what company specific requirements need to be included. Provides an illustrated step-by-step explanation—to meet customer requirements. Update Video includes Change Analysis Document detailing revisions paragraph by paragraph (14 page) and IPC-A-610 C-Revision (1 copy, 350 pages, full color.)
To help your company understand how to use the new Revision C of the Joint EIA / IPC Soldering Standard, IPC has created an introductory video that highlights the major changes to the EIA / IPC- J-STD-001C—Requirements for Soldered Electrical and Electronic Assemblies. Teresa Rowe, Co-Chair of the J-STD-001C Task Group, explains the revised format, major changes and updated process requirements, including: text blocks and defect summary tables; addition of four new technologies—including surface mount array packages; statistical vs. process control requirements; order of precedence with IPC-A-610C; changes in must / shall clause terminology; process indicators, and differences between hardware defects and material / process nonconformance’s. Provides a visual overview explaining how to integrate this new soldering standard into your electronics assembly process. Video includes one copy of the EIA / IPC-JSTD-001C, and a Change Analysis Document (32 pages.)
Explains common repair techniques for printed circuit assemblies. Each procedure includes damage analysis, industry approved repair procedures and evaluation criteria. 97-A covers laminate damage repair, rebonding isolated surface mount lands using adhesive bonding film and adhesive backed replacement lands, and rebonding lifted conductors using liquid epoxy overbond. 97-B covers conductor replacement—with adhesive backed material and liquid epoxy, repairing gaps in conductors, replacing straight and bent conductors, surface mount land/conductor replacement with adhesive backed material, and solder mask replacement. 2 videotapes, includes Leader’s Guides and Student Workbooks. (Winner of the Aurora Platinum Award—Best of Show.)
This third tape in a series on Land and Conductor Repair demonstrates the industry standard eyelet repair procedure for a damaged plated-through hole (without innerlayer connections) as described in IPC-7721. Begins by explaining when to repair a plated-through-hole, selection of the replacement eyelet—including measurements for board thickness, inside and outside eyelet diameter, length under the flange, flange diameter, and related tolerances. Also covers hole redrilling, funnel and flat swaging eyelets, soldering and conductor replacement. Includes Leader’s Guide and Student Workbook. (Winner of the Aurora Platinum Award—Best of Show.)
Begins by introducing industry specifications J-STD-001B & IPC-A-610B—and includes an explanation of the concept of Process Indicators. It then continues with an animated examination of the invisible problems that can be created during rework to explain why it’s so important to avoid unnecessary rework. Reviews each of the tools and materials for through-hole rework (including low-residue fluxes). Individual sections cover vacuum extraction of straight-through (round) leads; partially and fully clinched leads, DIP, and auxiliary heating techniques for large thermal mass boards and inaccessible leads. Also explains industry approved rework techniques for solder defects, including solder bridges, icicles, and excess / insufficient solder. Produced in cooperation with PACE, Inc. Includes Leader’s Guide and Student Workbook. (Also see VT-40 Slide Set / Photo CD in Image Resources). (Winner of the Communicator Award.)
Stresses the importance of avoiding unnecessary rework and shows how a cosmetic fix can create more problems than it solves—including damage to the component, the board and adjacent solder joints. Provides guidelines for rework decisions and basic acceptance criteria. Also covers: flux usage and residues; pre-cleaning; prebaking; flux cored solder types and thickness; solder paste application and volume. Discusses practical theory and application criteria for each of the conductive and convective heating systems used in surface mount rework. Includes Leader’s Guide and Student Workbook. First in a series of four videos, produced in cooperation with Pace, Inc. (Telly Award winner.)
Begins with an explanation of chip component terminology and size codes. Details flux considerations and land preparation using solder braid and vacuum extractor. Demonstrates industry approved techniques and common problems to avoid during removal and replacement of all types of chip components using the following hand tools: hand soldering iron (single-point and bifurcated tip); pulse heat tweezers; continuous heat tweezers; and hot air pencil. Also explains adhesive bonded components, and special heating considerations for ceramic chip capacitors. Includes Leader’s Guide and Student Workbook. Second in a series, produced in cooperation with Pace, Inc. (Telly Award winner.)
High-quality microphotography and computer animation provide precise visual instruction on industry-approved techniques for the removal of all types of gull wing components (QFPs, SOICs, TSOPs, and SOTs) using a hand soldering iron, thermal tweezers, and thermal vacuum pick. Land preparation using solder braid and vacuum extraction, and component replacement using a hand soldering iron, hot air pencil, continuous flow solder and hot bar are demonstrated. Also covers gull wing component ID / handling, tool preparation and maintenance and heat enhancement techniques. Includes (2) videotapes, Leader’s Guide, Student Workbook. Third in a series, produced in cooperation with PACE Inc.
Begins with PLCC / SOJ component descriptions and terminology. Demonstrates component removal with the pulse-heated hand tool, and thermal tweezers, using three different heat enhancement techniques (flux, bridge-fill, and solder wrap). Reviews land preparation, component orientation and alignment techniques. Shows component replacement using point to point, continuous flow, and hot air pencil soldering techniques. Also discusses cleaning options. The fourth and final tape in a series produced with PACE Inc. Winner of the Aegis and Aurora Gold Awards.
Begins with a discussion of the practical uses of rework stations for high volume rework, and for BGAs / ultra fine-pitch QFPs. Continues with an examination of rework issues, including heat source, preheating and component alignment. Explains step-by-step procedures for fine pitch QFP removal, site preparation and replacement. Concludes with a discussion on cleaning and inspection requirements. Includes Leader’s Guide and Student Workbook. (Winner of Aegis and Telly Awards.)
BALL GRID ARRAY REWORK
Begins with a discussion of the advantages and challenges of ball grid arrays, including component descriptions and terminology. Provides an overview of removal / replacement procedures for ball grid arrays, using hot air and conductive heating equipment. Covers site preparation, component alignment, solder paste printing, and preheating considerations. Explores potential problems, including moisture sensitivity, heating of adjacent components/ solder joints, and potential soldering defects. Also reviews X-ray techniques for solder joint inspections / evaluation. Includes Leader’s Guide and Student Workbook. (Telly Award winner.)
An introductory overview of the component preparation and manual insertion process. A cast of animated characters explain the kitting or picking process, temporary solder mask application, lead preparation/preforming (using manual and mechanical systems), stress relief theory, lead crimping, lead contamination, legends, component orientation and polarization, adhesive bonding, assembly line operation, ESD basics, personal safety issues, and end product acceptance criteria from the IPC-A-610. Includes Leader’s Guide and Student Workbook. (Winner of the Aegis and Communicator Awards.)
Provides an in-depth look at the wave soldering process, beginning with typical setup/adjustment procedures for conveyors, controls, spray, foam and wave fluxers (including rosin, water soluble, and low residue fluxes), convection and radiation preheaters, air knives, and wave adjustment. Also explains thermal profiles, solder compositions, wave shapes and purposes. Reviews standard operating procedures, including adding solder, removing dross, proper clothing, safety requirements, and board stiffeners. A final section on troubleshooting examines common defects, causes and solutions. Includes Leader’s Guide and Student Workbook.
An introductory overview of the through-hole assembly processes. Begins with a description of the basic functions of typical components and interconnections; component location grids; letter codes and polarity markings. Provides a visual explanation of DIP insertion, axial insertion, lead preforming/manual insertion. Also reviews wave soldering, hand soldering, cleaning and testing. Discusses common problems to avoid, and stresses the importance of the individual operator throughout the process. A useful introduction for new hires and general education. Includes Leader’s Guide and Student Workbook.
An introductory overview of the surface mount assembly processes. Begins with a review of component evolution from through-hole to surface mount, then describes the standard component types. Explains the solder paste printing process; mixed technology assemblies—including adhesive application, autoplacement of components, reflow soldering, infrared, (convection and combination) visual inspection, cleaning, secondary reflow, electrical and burn-in testing. A useful introduction for new hires, cross training, and general education. Includes Leader’s Guide and Student Workbook.
Introduces viewers to the features of surface mount component placement machines—including the methods of feeding components, the heads used to place the components, the system of rails that transfer the circuit boards through the machine and the vision system that verifies board orientation and the accuracy of placement. Continues with typical set up and operation procedures designed to teach the operator how to interact with these systems. Concludes with a description of the types of problems that can occur with placement machines, possible solutions and tips for preventive maintenance. Includes Leader’s Guide and Student Workbook.
First of two in a series (with IPC-VT-35) begins with an introduction to the key elements in solder paste printing: the circuit board, stencil, solder paste and squeegee. Describes how each element affects the printing process. Discusses automatic and semiautomatic stencil printers, focusing on what the operator needs to understand to set up and monitor all aspects of the printing operation. Concludes with a description of general operator maintenance, emphasizing safety and proper clean-up. Includes Leader’s Guide and Student Workbook.
Second in a series it defines typical defects associated with solder paste printing, discusses possible causes, and offers recommended solutions. Reviews lack of coverage, bridging, misalignment, solder paste volume / print shape, including dog-ear, pump, scoop, slope, and edge definition. Adjustments include kneading paste, squeegee pressure and speed, downstop, snap-off, and temperature. Stresses the importance of preventive maintenance. Includes Leader’s Guide and Student workbook.
Videotape 1 explains the different types of reflow soldering processes, including I/R, convection, and convection I/R. Also covers solder pastes, creams, and fluxes. Videotape 2 provides a detailed study of thermal profiles for reflow soldering. Includes ESD protection, process contamination, and handling considerations. Also demonstrates how solder, flux and components are applied to the board. Includes Leader’s Guide and Student Workbook. Two videotapes.
A visual introduction to the wire harness manufacturing process for new hires. Begins by explaining the basic functions of the board, components and wire harness. Clearly demonstrates the entire fabrication process, including: drawings and specification review; wire preparation (cutting, stripping and tinning); shaping the harness; wire termination processes (soldering and crimping); tying the harness; inspection, testing, and quality assurance standards; shipping; installation and safety considerations. Produced in cooperation with the Wire Harness Manufacturers Association. Includes Leaders Guide and Student Workbook. (Winner of the Telly Award.)
Designed to provide new employees with a visual overview of the wire crimping processes. Explains the terminology and anatomy of crimping, and reviews quality assurance requirements. Begins by exploring wire types, insulation, diameters, gauges, variation, and stripping processes (manual and automatic). Explains terminal types, including ring and spade, insulated and uninsulated, open and closed barrels, and types of contacts. Details manual, semi-automatic, and fully automatic crimping systems—including setup / calibration, bend testing, crimp height measurement, pull testing and production. Reviews acceptance criteria for open and closed barrel crimps, criteria for a preferred crimp, and analysis of typical problems. Includes Leaders Guide and user customizable student test. Winner of the Telly Award and ITVA Finalist. Produced in cooperation with the Wire Harness Manufacturers Association. Two videos.
A visual introduction to wire preparation for wire harness manufacturing. Begins by explaining wire types, characteristics, AWG, and insulation. Explains typical setup and operation of manual, semi-automatic, and fully automatic wire strippers for low, medium and high volume applications. Defines parameters for cut and strip length, partial strips, cutting depth, wayback values, feed rates, and cut speed. Demonstrates stripping of insulation off multi-conductor cables, removing insulation from large diameter cables, out of round, and twisted-shielded pairs. Includes multiple-step stripping of coaxial cable, and tough insulation. Reviews typical problems including jam-ups and wire curling. Provides evaluation guidelines for nicks, scrapes, broken strands, insulation damage, frays, and reduced insulation thickness. Also covers wire tinning and operator safety.
An excellent introduction for new hires. Produced in cooperation with the Wire Harness Manufacturers Association. Includes Leader's Guide and user customizable student test. (Winner of the Communicator Award.)
Eliminating solder joint touch-up and inspection will improve product quality and reduce cost, yet it often seems impossible to develop and maintain this level of efficiency. This two video workshop explains the basic technical requirements and the organizational linkage that must be developed for such a program to function correctly and permanently.
The workshop provides all the information necessary to initiate a Zero Defect Program, including the theory of making a solder joint, the importance of the intermetallic compound, the importance of wetting and solder joint criteria, understanding and selecting fluxes and solder, the danger of rework and how to avoid it, solder joint inspection—the expensive, ineffective operation, process control and the soldering process, defining responsibilities and authorities, and putting together a complete zero defect program. Presented by Ralph Woodgate of WoodCorp. Includes 52 page handbook—containing 149 images presented during the Workshop. Edited to two videotapes.
IPC is proud to announce the availability of this new and innovative video training series of three interview-based programs. The series provides an overview of Continuous Improvement, specifically tailored for the process level industrial operator within the Electronic Interconnection Industry. This series was designed as an initial introduction or “first exposure” to the CI philosophy. Available for purchase individually or as a set.
Part 1: Tools and Materials.
An introductory explanation of the terminology and tools for hand soldering. Covers workbench cleanliness and contamination, personal safety, ESD, soldering irons and tips, heat transfer, thermal damage, solder types and sizes, fluxes, oxidation, wetting, intermetallic, and flux residues.
Part 2: Soldering Techniques
Explains the hand soldering process for through-hole components, from tip maintenance to flux removal. Also describes the characteristics of the ideal solder joint and the results of improper techniques, including: cold/disturbed joints, fractures, thermal damage, lifted lands, barrel cracks, blowholes, excess solder, bridging, non-wetting and dewetting. Includes Leader’s Guide and Student Workbook. Spanish language version.
Explains the importance of each person’s contribution to the success of the printed circuit board manufacturing process. Provides an interactive format, allowing groups of operators to discuss the causes of handling damage within their specific process. Question and answer sections encourage groups to come up with their own solutions to prevent common handling defects. A valuable space promote careful handling and reduce unnecessary defects. Spanish language version.