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PCB310 PACTECH Flip Chip Test and Evaluation Kit and Board


The PACTECH Flip Chip Test & Evaluation board is for placement and daisy chain continuity testing after assembly. Substrate has 14 mounting sites for 10 x 10mm Flip Chips. With an increasing number of I/O’zs on Integrated Circuits and accompanying requirements for high performance, flip chip type components are a compelling technology for potential users. PACTECH test die are combined with test boards to provide customers with the ability to test a variety of specs and processes. The components and test board are daisy-chained for continuity. The PCB310 PacTech Board is single sided with 14 pads to accommodate 2 rows of 7 Pac2.3-572-200/400-10mm die each.

Solder practice test vehicle PCB boards and kits are for machine setup, evaluation, qualification, workflow analysis, prototyping, testing, solder profiling.

 

 

Notes

  • Board size is 6.3" x 3.95", 2 layers, .062" thick.
  • Board material is IS410-High Temp 180Tg.
  • Standard board finish OSP Entek CU-A-HT.
  • Gerber and X,Y Theta data included at no charge.

 

Order Number: 12299 PCB310-PACTECH (board only)

Order Number: 12312 Pac2.3-FA572-200/400-10mm-DC-305 (Rows 2 and 3)

 

 



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