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PC2009 AIM Solder Print Test Board and Kit


The AIM print test board was designed to include many printing challenges which are commonly encountered on manufacturers assemblies. BGA pads have circular and square pad design to test paste release. AIM has included the standard IPC slump test pattern in order to further challenge the properties of any product tested thereon. This print pattern is more real life and more accurate to predict slump since individual pads are used instead of one pad that is common in the “thermometer” method. There is a number on the board indicating the distances between pads so a hard number can be used for paste evaluations.

Solder practice test vehicle PCB boards and kits are for machine setup, evaluation, qualification, workflow analysis, prototyping, testing, solder profiling.

Common pad sizes were incorporated into the layout including 1206, 0805 and 0603 rectangular pads for discrete components. These pads have varying distance between them so the user can determine solder beading of paste. Four 250 x 250mil pads are available to be utilized with various aperture styles in order to allow for wetting tests. There are also several fine pitch QFP pads designed to check for the propensity of any given product to cause bridging and to confirm the existence of torn prints, peaking (dog ears), or bridging.

 

Notes

* Digitized gerber files provided by Aegis Software included at no charge.

* Kit available with Tin/Lead and Pb-free components.

 

Board material is IS-410.

Standard finish: ImAg.

Board size: 8.5" x 6".



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