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Wafer Chip Size Package (WLP) Dummy Component


WLP
Wafer Chip Size Package

Our dummy WLP uses interconnection technology to effectively utilize the chip area by making it possible to form electrodes over the entire chip surface. This eliminates the need for the wire bonding space required by previous wiring methods. Also, electrodes are formed using copper posts for a simple structure.

All of this means that the area of the finished dummy component package is exactly the same compact size as the original chip. It also simplifies mounting and contributes to easier high-density mounting. WLP is the perfect choice for packaging chips used in portable telephones, digital cameras, and other applications where mounting space is severely restricted.

WLP

Part Description

I/O
Count

Pitch

Body
Size

Alloy

WLP196-.3mm-4.2mm-DC-SAC305

196

.3mm

4.2mm sq

96.5%Sn/3.0%Ag/0.5%Cu

WLP256-.3mm-4.8mm-DC-SAC305

256

.3mm

4.8mm sq

96.5%Sn/3.0%Ag/0.5%Cu

WLP264-.3mm-6mm-DC-SAC305

264

.3mm

6mm sq

96.5%Sn/3.0%Ag/0.5%Cu

WLP400-.3mm-6mm-DC-SAC305

400

.3mm

6mm sq

96.5%Sn/3.0%Ag/0.5%Cu

WLP676-.3mm-7.8mm-DC-SAC305

676

.3mm

7.8mm sq

96.5%Sn/3.0%Ag/0.5%Cu

*Available on tape and reel

 

 

 

 

Part Description System


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* Ultra thin type, Ultra miniature, Lightweight

* High current capacity and good heat radiation

* Stress buffer structure

* High reliability of WLP as semiconductor package makes KGD issues cleared.

* Cu-to-Cu wiring structure

* Include inductors of high Q value

* Possibility of SMT assembly

* Coplanarity (5 to 10 µm)

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