888-388-7808

Super BGA (SBGA) Dummy Component


31277.png

SBGA
Dummy SuperBGA®

SuperBGA® Dummy (SBGA) package is a very low profile, high-power BGA. The IC is directly attached to an integrated copper heatsink. Since the IC and the I/O are on the same side, signal vias are eliminated. The dummy die enables the Practical Dummy Component to have the same characteristics as the live component.

SBGA SuperBGA® 1.27mm Pitch

Part Description

I/O Count

Pitch

Body Size

Ball Matrix

Ball
Alignment

Quantity
Per Tray

A-SBGA256-1.27mm-27mm

256

1.27mm

27mm

20 x 20

Perimeter

40

A-SBGA304-1.27mm-31mm

304

1.27mm

31mm

23 x 23

Perimeter

27

A-SBGA352-1.27mm-35mm

352

1.27mm

35mm

26 x 26

Perimeter

24

A-SBGA432-1.27mm-40mm

432

1.27mm

40mm

31 x 31

Perimeter

21

A-SBGA520-1.27mm-40mm

520

1.27mm

40mm

31 x 31

Perimeter

21

A-SBGA560-1.27mm-42.5mm

560

1.27mm

42.5mm

33 x 33

Perimeter

12

A-SBGA600-1.27mm-45mm

600

1.27mm

45mm

35 x 35

Perimeter

12

Notes

* Superior thermal performance.

* Light weight

* Low profile (1.4mm mounted)

* Moisture resistant (JEDEC level 3)

* JEDEC MO-192 standard outlines

* Enhanced electrical performance > 1 GHz

* Parts are packaged in JEDEC trays.

* Call for tape and reel quantity and availability.

* Solder ball material is eutectic 63/37 SnPb.

* BGA packages should be baked at 125°C for 24 hours prior to assembly to prevent delamination during assembly process.

* Parts can be baked and dry-packed.

* All components are daisy-chained except for 520 I/O.

* Lead-free parts are available with (SAC405 )95.5% Sn/ 4.0% Ag/ 0.5% Cu alloy or 96.5%Sn/3.0%Ag/0.5%Cu alloy (SAC305). Sn3.5Ag is also available (call for availablity).

* SBGAs are not available without solder balls.

Part Description System

7395.png

* Add "TR" to end of part number for Tape and Reel.

* Add "SAC405" or "SAC305" or "Sn3.5Ag" to end of part number for Lead-Free.

7139.png

Note: Drawing not to scale.

7214.png

Package

Pitch

A

B

C

SBGA

1.27

.76

.62

.52

All units in mm.



Assumptions: 5 mils solder paste. Solder mask defined pad. Typical motherboard no solder mask defined pad:




* 0.50 Pitch 0.28

* 0.80 Pitch 0.30

* 1.00 Pitch 0.38




IPC Validation Services

New Product

.4mm Pitch eWLP Dummy Wafer-Amkor
.4mm Pitch eWLP Dummy Wafer-Amkor

Walts

Technical Center

In the News

Practical Components’ Publishes New 2017 Product Catalog
This catalog marks a major revision to the Practical Components catalog. Inside you will find over 20 pages of new products and for the first time much of it is printed ... [read more]

Request Catalog

Catalog

Request or download our catalog and sign-up for our newsletter.

Continue