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.4mm Pitch eWLP Dummy Wafer-Amkor


 .4mm Pitch eWLP Dummy Wafer-Amkor

A-eWLP-Dummy Component Wafer-.4-CuPd-DC-NB (P/N 32100) 8” wafers embedded copper pads (no balls) daisy-chained 0.4mm pitch / 725um thickness.

 

Offered as uncut whole wafers or diced die. Backgrinding to 200um.

Die can be packaged on Tape & Reel (pads down) or on tape/ring (no DAF).

Pad I/O

Pad Matrix

Pitch

Die Sizes

Tape & Reel

4

2x2

0.4mm

0.76mm

W=8mm P=4mm

16

4x4

0.4mm

1.56mm

W=8mm P=4mm

36

6x6

0.4mm

2.36mm

W=12mm P=8mm

64

8x8

0.4mm

3.16mm

W=12mm P=8mm

100

10x10

0.4mm

3.96mm

W=12mm P=8mm

144

12x12

0.4mm

4.76mm

W=12mm P=8mm

196

14x14

0.4mm

5.56mm

W=12mm P=8mm

 




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.4mm Pitch eWLP Dummy Wafer-Amkor
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